DocumentCode :
278595
Title :
A semidistributed model for the noise and scattering parameters of a HEMT
Author :
Hickson, M.T. ; Gardner, P. ; Paul, D.K.
Author_Institution :
Dept. of Electr. Eng. & Electron., Univ. of Manchester Inst. of Sci. & Technol., UK
fYear :
1991
fDate :
33526
Firstpage :
42675
Lastpage :
1110
Abstract :
The authors present details of a new model for millimetric HEMT devices taking into account the distributed effects of the gate and drain lines and the non-uniformity of the structure at the gate feed region. The effects of distribution are considered by dividing the active region into equal slices whose dimensions are small when compared to the minimum guided wavelength. Each slice is modelled as an intrinsic HEMT with thermal noise sources. The slices are connected together through lossy reactances. The first slice differs from the remaining slices to allow for non-uniformity. The model was implemented and optimised using a commercial CAD package. It is shown to provide a good fitting of the manufacturer´s measured S-parameters and noise parameters from 2 to 40 GHz for a super low noise millimetric HEMT chip. A significant improvement in the fitting of the noise parameters is shown. The significance of the distributed effects is shown by comparing the predictions of the optimised model with those of an unsliced model. The effect of the non-uniform structure is shown by a comparison of the parameters of the first slice and those of the remaining slices in the optimised model
Keywords :
S-parameters; electron device noise; high electron mobility transistors; solid-state microwave devices; thermal noise; 2 to 40 GHz; CAD package; EHF; MM-wave device; S-parameters; SHF; distributed effects; drain lines; gate feed region; lossy reactances; low noise chip; millimetric HEMT devices; noise parameters; nonuniform structure; scattering parameters; semidistributed model; thermal noise sources;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Computer Based Tools for Microwave Engineers, IEE Colloquium on
Conference_Location :
London
Type :
conf
Filename :
181966
Link To Document :
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