DocumentCode
2786045
Title
Application of reactive ion etching using C/sub 2/H/sub 6//H/sub 2/O/sub 2/ to fabricate a 1.48 /spl mu/m lnGaAsP/InP p-substrate buried-heterostructure laser diode
Author
Sugimoto, H. ; Isu, T. ; Tada, H. ; Miura, T. ; Shiba, T. ; Kimura, T. ; Takemoto, A.
Author_Institution
Mitsubishi Electric Corporation
fYear
1992
fDate
21-25 Sept. 1992
Firstpage
58
Lastpage
59
Abstract
Reactive ion etching using C/sub 2/H/sub 6//H/sub 2//O/sub 2/ realized sufficiently smooth etched surface and little side-etching for the fabrication of ridge mesa structures of the commercially produced PPlBH laser diodes. No degradation of the laser characteristics was observed.
Keywords
Aging; Diode lasers; Electrons; Indium phosphide; Life estimation; Rough surfaces; Surface roughness; Temperature; Threshold current; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Laser Conference , 1992. Conference Digest. 13th IEEE International
Conference_Location
Kagazwa, Japan
Print_ISBN
4-930813-51-4
Type
conf
DOI
10.1109/ISLC.1992.763570
Filename
763570
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