DocumentCode :
2786086
Title :
Failure Analysis Of Power Modules; A Look At The Packaging And Reliability Of Large IGBTs
Author :
De Lambilly, H. ; Keser, H.
Author_Institution :
Asea Brown Boveri Corporate Research Center, Baden, Switzerland.
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
366
Lastpage :
370
Keywords :
Assembly; Cooling; Failure analysis; Insulated gate bipolar transistors; Multichip modules; Packaging; Temperature measurement; Testing; Thermal resistance; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639922
Filename :
639922
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2786086
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