Application of nonparametric approach to rapid thermal processing systems modeling

Rapid thermal processing systems (RTP) are currently being developed for single-wafer manufacturing of integrated circuits. In order to achieve slip-free and uniform processing, it is necessary to maintain near uniform temperature distribution over the wafer. Recent innovations in RTP design have provided the ability to achieve temperature uniformity. One recent approach employs multiple concentric circular rings of lamps that can be controlled independently so as to adjust the heat flux over the wafer to maintain a reasonable uniform temperature over a range of operating conditions. To solve problems of RTP systems design and control problem solutions, it is necessary to construct a process model. In this paper, the authors introduce a nonparametric method of RTP system modeling