Title :
Inter-firm collaboration for transaction of silicon intellectual property in IC design service industry
Author :
Su, Yea-Huey ; Hung, Chia-Liang ; Cheng, Li-Ping
fDate :
Sept. 11-13, 2005
Keywords :
Collaboration; Collaborative tools; Companies; Costs; Industrial economics; Integrated circuit packaging; Integrated circuit synthesis; Intellectual property; Semiconductor process modeling; Silicon;
Conference_Titel :
Engineering Management Conference, 2005. Proceedings. 2005 IEEE International
Print_ISBN :
0-7803-9139-X
DOI :
10.1109/IEMC.2005.1559280
