Title :
A novel equivalent circuit for on chip transmission lines modeling
Author :
Zeng, Dajie ; Wang, Hongrui ; Yang, Dongxu ; Zhang, Li ; Wang, Yan ; Yu, Zhiping ; Zhang, Yaohui
Author_Institution :
Inst. of Sinano, CAS, Suzhou, China
Abstract :
Microstrip transmission line (MS), coplanar waveguide transmission line (CPW), grounded coplanar waveguide transmission line (GCPW), slow-wave transmission line with slotted grounded shields (GSCPW), slow-wave transmission line with slotted floating shields (FSCPW) are widely used in the silicon technology. Because the quasi-TEM assumption is still valid in these structures, an equivalent circuit is proposed to model all these structures. In this work, we notice that for some types of transmission lines, say GCPW and GSCPW, the per unit length capacitance increases with frequency. An LC series subcircuit is proposed to model this phenomenon. For CPW, GCPW, GSCPW and FSCPW, the model has very good accuracy and fits the measurement results very well up to the highest measurement frequency (40GHz). For MS, the results from the 3D EM simulation software are adopted and the model shows a great agreement with the simulation results up to the highest simulation frequency (100GHz).
Keywords :
coplanar transmission lines; coplanar waveguide components; equivalent circuits; expectation-maximisation algorithm; integrated circuit modelling; microstrip lines; slot lines; slow wave structures; 3D EM simulation software; FSCPW model; GSCPW model; LC series subcircuit; equivalent circuit; frequency 40 GHz; grounded coplanar waveguide transmission line; microstrip transmission line; on chip transmission lines modeling; quasiTEM assumption; silicon technology; slotted floating shield; slotted grounded shield; slow-wave transmission line; Coplanar waveguides; Frequency measurement; Integrated circuit modeling; Metals; Power capacitors; Power transmission lines; Transmission line measurements;
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2010 IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-5758-8
DOI :
10.1109/CICC.2010.5617424