DocumentCode :
2788438
Title :
Reliability analysis of analog circuits using quadratic lifetime worst-case distance prediction
Author :
Pan, Xin ; Graeb, Helmut
Author_Institution :
Inst. for Electron. Design Autom., Tech. Univ. Muenchen, Munich, Germany
fYear :
2010
fDate :
19-22 Sept. 2010
Firstpage :
1
Lastpage :
4
Abstract :
This paper proposes an efficient method to predict the lifetime yield of analog circuits considering the joint effects of manufacturing process variations and parameter lifetime degradations. The method uses the idea of worst-case distance, which is an indicator of circuit robustness concerning process variations. The worst-case distance in circuit lifetime is predicted based on a new, quadratic prediction model in time domain. The lifetime yield of the circuit is obtained based on this quadratic model. We prove for the first time that the lifetime yield value is directly applicable to the calculation of reliability function and lifetime distribution of analog circuits, while previous modeling techniques either are only applicable for digital circuits, or require long simulation time. The experimental results show that the proposed method has an average error smaller than 5%, with a speed up of six times in comparison to an iterative optimization based lifetime yield analysis method.
Keywords :
analogue circuits; integrated circuit reliability; manufacturing processes; analog circuits; lifetime yield analysis method; manufacturing process variations; parameter lifetime degradations; quadratic lifetime worst-case distance prediction; reliability analysis; Analog circuits; Degradation; Integrated circuit modeling; Logic gates; Predictive models; Reliability engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2010 IEEE
Conference_Location :
San Jose, CA
ISSN :
0886-5930
Print_ISBN :
978-1-4244-5758-8
Type :
conf
DOI :
10.1109/CICC.2010.5617446
Filename :
5617446
Link To Document :
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