Keynote address: critical issues in wafer scale design

Summary form only given. The author discusses critical barriers to the further developments of wafer-scale design technology and its successful transfer to industry. These include: 1) difficulty in obtaining multireticle stepper lithography for sub 2-micron fabrication, (2) limitation to two levels of metal and resulting problems in power and clock distribution, (3) excessive turnaround time because of limitations of wafer-scale design tools, and (4) compromise in performance because of the emphasis on using foundry fabrication which excludes the use of vertical links, overglass optimized for laser penetration and other custom fabrication techniques