• DocumentCode
    2788587
  • Title

    SuperChip packaging issues for advanced signal processors

  • Author

    Hurt, Paula R. ; Massaron, Laurence I. ; Hamilton, Paul J.

  • Author_Institution
    TRW, Redondo Beach, CA, USA
  • fYear
    1992
  • fDate
    22-24 Jan 1992
  • Firstpage
    14
  • Lastpage
    18
  • Abstract
    TRW is developing a miniaturized microelectronic, high-performance vector signal processor (VSP) for use in next-generation spaceborne processors and computer workstations. The VSP consists of a monolithic very-high-speed integrated circuit (VHSIC) wafer scale device, the CPUAX (Central Processing Unit Arithmetic eXtended) SuperChip, and two very complex multichip modules, the Control Memory and the Vector Memory. The authors discuss the issues related to packaging the large, high-performance, low-voltage, high-speed digital monolithic VHSIC wafer scale CPUAX SuperChip. Eight packaged CPUAX SuperChips underwent full functional tests on a Hewlett Packard 8200 system with a customized high-speed interface board. All macrocells responded optimally over the full ranges of power (3.0 to 3.3 volts) and temperature (-55 to+125°C), and at frequencies up to 90 MHz. Some response degradation was noticed between 90 and 100 MHz
  • Keywords
    VLSI; integrated circuit testing; microprocessor chips; packaging; -55 to 125 C; 100 MHz; 3.0 to 3.3 V; CPUAX; Central Processing Unit Arithmetic eXtended; SuperChip; TRW; VHSIC; VSP; WSI; advanced signal processors; computer workstations; frequencies; functional tests; macrocells; monolithic chip; next-generation spaceborne processors; packaging; packaging issues; temperature; vector signal processor; wafer scale device; wafer scale integration; Arithmetic; Central Processing Unit; Centralized control; Integrated circuit packaging; Microelectronics; Multichip modules; Signal processing; System testing; Very high speed integrated circuits; Workstations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1992. Proceedings., [4th] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-2482-5
  • Type

    conf

  • DOI
    10.1109/ICWSI.1992.171791
  • Filename
    171791