Title :
Proceedings. International Conference on Wafer Scale Integration (Cat. No.92CH3088-2)
Abstract :
The following topics were dealt with: the TRW superchip; wafer scale integration (WSI) applications; reconfigurable array concepts, the wafer-scale associative string processor; multichip modules; WSI interconnect; WSI design issues; and testing and testability. Abstracts of individual papers can be found under the relevant classification codes in this or other issues
Keywords :
VLSI; digital integrated circuits; integrated circuit testing; metallisation; microprocessor chips; MCM; TRW superchip; WAP; WSI; WSI design issues; WSI interconnect; multichip modules; reconfigurable array concepts; testability; testing; wafer scale integration; wafer-scale associative string processor;
Conference_Titel :
Wafer Scale Integration, 1992. Proceedings., [4th] International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-8186-2482-5
DOI :
10.1109/ICWSI.1992.171843
