Title :
A routing methodology for three-dimensional microelectronic structure
Author :
Tong, C.C. ; Wu, C.L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
The authors define the three-dimensional routing geometry and propose a routing methodology. The routing problem is divided into two independent parts: in-layer routing. The inter-layer routing problem is transformed into a traditional two-dimensional routing problem. Extra rows and/or columns may be needed to complete the transformation
Keywords :
circuit layout CAD; integrated circuit technology; network topology; 3D routeing geometry; in-layer routing; routing methodology; three-dimensional microelectronic structure; Computational geometry; Etching; Microelectronics; Printed circuits; Routing; Silicon compounds; Silicon on insulator technology; Two dimensional displays; Very large scale integration; Wiring;
Conference_Titel :
Circuits and Systems, 1990., Proceedings of the 33rd Midwest Symposium on
Conference_Location :
Calgary, Alta.
Print_ISBN :
0-7803-0081-5
DOI :
10.1109/MWSCAS.1990.140681
