Effects of wafer-level packaging on millimetre-wave antennas

Author

AbuTarboush, H.F. ; Tawfik, H.H. ; Soliman, E.A. ; Sallam, M.O. ; Shamim, A. ; Sedky, S.M.

Author_Institution

Sch. of Sci. & Eng., American Univ. in Cairo (AUC), New Cairo, Egypt

fYear

2011

fDate

14-15 Nov. 2011

Firstpage

1

Lastpage

4

Abstract

A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna´s reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations.

Keywords

integrated circuit packaging; micromechanical devices; millimetre wave antennas; EM simulations; MEMS antennas; cost-effective antenna package; frequency 60 GHz; mass production; millimetre-wave antennas; radiation efficiency; wafer-level packaging effects; Antennas; Bonding; Glass; Micromechanical devices; Packaging; Packaging; Small Antenna; Wafer-Level Packaging; mm-Wave Antenna;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Conference (LAPC), 2011 Loughborough

Conference_Location

Loughborough

Print_ISBN

978-1-4577-1014-8

Electronic_ISBN

978-1-4577-1015-5

Type

conf

DOI

10.1109/LAPC.2011.6113964

Filename

6113964