Title :
Effects of wafer-level packaging on millimetre-wave antennas
Author :
AbuTarboush, H.F. ; Tawfik, H.H. ; Soliman, E.A. ; Sallam, M.O. ; Shamim, A. ; Sedky, S.M.
Author_Institution :
Sch. of Sci. & Eng., American Univ. in Cairo (AUC), New Cairo, Egypt
Abstract :
A cost-effective antenna package suitable for mass production mm-wave applications is investigated. Different packaging material that can be possibly used in mm-wave antennas are presented and compared. Moreover, this study investigates different methods of packaging millimetre-wave (60 GHz) MEMS antennas. The paper first introduces the custom needs for optimum operation of the MEMS antenna and then examines the current available enabling technologies for packaging. The sensitivity of the antenna´s reflection coefficient, gain and radiation efficiency to the packaging environment is investigated through EM simulations.
Keywords :
integrated circuit packaging; micromechanical devices; millimetre wave antennas; EM simulations; MEMS antennas; cost-effective antenna package; frequency 60 GHz; mass production; millimetre-wave antennas; radiation efficiency; wafer-level packaging effects; Antennas; Bonding; Glass; Micromechanical devices; Packaging; Packaging; Small Antenna; Wafer-Level Packaging; mm-Wave Antenna;
Conference_Titel :
Antennas and Propagation Conference (LAPC), 2011 Loughborough
Conference_Location :
Loughborough
Print_ISBN :
978-1-4577-1014-8
Electronic_ISBN :
978-1-4577-1015-5
DOI :
10.1109/LAPC.2011.6113964
