A device characterization technique using per-die test structures for mixed-signal integrated circuits

Author

Goel, Nishith ; Issa, Tomy Y. ; Siddiqui, Atique ; Hobin, Gary

Author_Institution

Northern Telecom Electron. Ltd., Nepean, Ont., Canada

fYear

1990

fDate

1-3 Oct 1990

Firstpage

145

Lastpage

149

Abstract

The authors present a characterization methodology using per-die test structures to address the need for accurate and reliable product-process models for mixed-signal IC designs. These product-process relationships are critical in generating guardbands and forecasting production yields based on predicted product performance across process variations. Guardband generation, the per-die test structures, and the product-process transformation for analog and digital circuits are discussed

Keywords

application specific integrated circuits; integrated circuit manufacture; integrated circuit testing; production testing; characterization methodology; device characterization technique; guardbands; mixed-signal integrated circuits; per-die test structures; process variations; product-process models; production yields; Circuit testing; Environmental factors; Fabrication; Integrated circuit modeling; Mixed analog digital integrated circuits; Production; Semiconductor device modeling; Temperature distribution; US Department of Energy; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.114997

Filename

114997