System-in-package integrated antennas in industrial and prospective packages for MMW applications

During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. In order to address these issues, we review in this paper achievable antenna performance discussing possible integration schemes at industrial level, describing industrial substrate solutions for MMW large volume consumer applications, antenna design optimization and 3D on wafer characterization. HR SOI CMOS integrated antennas and High Temperature Co-fired Ceramics (HTCC) substrate based antennas are described with measured gain values of 3.7 dBi and 5.8 dBi at 60 GHz, respectively.