Title :
System-in-package integrated antennas in industrial and prospective packages for MMW applications
Author :
Pilard, Romain ; Gianesello, Frederic ; Gloria, Daniel
Author_Institution :
TPS-Labs., STMicroelectron., Crolles, France
Abstract :
During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. In order to address these issues, we review in this paper achievable antenna performance discussing possible integration schemes at industrial level, describing industrial substrate solutions for MMW large volume consumer applications, antenna design optimization and 3D on wafer characterization. HR SOI CMOS integrated antennas and High Temperature Co-fired Ceramics (HTCC) substrate based antennas are described with measured gain values of 3.7 dBi and 5.8 dBi at 60 GHz, respectively.
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; ceramic packaging; industrial engineering; millimetre wave antennas; millimetre wave integrated circuits; optimisation; silicon-on-insulator; system-in-package; 3D on wafer characterization; BiCMOS technology; HR SOI CMOS integrated antenna; MMW large volume consumer application; RFIC; antenna design optimization; antenna performance; chipset solution; frequency 60 GHz; high temperature cofired ceramics substrate based antenna; industrial package; industrial substrate solution; low cost antenna; prospective package; system-in-package integrated antenna; Antenna measurements; Antenna radiation patterns; Assembly; Silicon; Substrates; System-on-a-chip;
Conference_Titel :
Antennas and Propagation Conference (LAPC), 2011 Loughborough
Conference_Location :
Loughborough
Print_ISBN :
978-1-4577-1014-8
Electronic_ISBN :
978-1-4577-1015-5
DOI :
10.1109/LAPC.2011.6114009
