An inside body power and bidirectional data transfer IC module pair

Author

Lee, Edward K F

Author_Institution

Alfred Mann Found., Santa Clarita, CA, USA

fYear

2010

fDate

19-22 Sept. 2010

Firstpage

1

Lastpage

4

Abstract

An IC module pair connected with 3 wires was proposed for an implant that consisted of a master unit (MU) and a small, light-weight satellite unit (SU). Power was delivered from the MU to the SU using a 3-phase signal, and converted to DC in the SU by a passive MOS AC-DC converter. Data transfer between the two units was achieved by modulating the amplitudes and the positions of the rising and falling edges of the 3-phase signal. A bidirectional data rate in the range of MB/s and an overall power efficiency of 90.2% for a 3.2mW load were achieved in a 0.18μm CMOS process.

Keywords

AC-DC power convertors; CMOS integrated circuits; amplitude modulation; biomedical electronics; prosthetics; 3-phase signal; CMOS process; IC module pair; amplitude nodulation; bidirectional data rate; bidirectional data transfer; implant; inside body power; light-weight satellite unit; master unit; passive MOS AC-DC converter; power 3.2 mW; power efficiency; size 0.18 mum; Amplitude modulation; Demodulation; Downlink; Driver circuits; Integrated circuits; Satellites;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference (CICC), 2010 IEEE

Conference_Location

San Jose, CA

ISSN

0886-5930

Print_ISBN

978-1-4244-5758-8

Type

conf

DOI

10.1109/CICC.2010.5617605

Filename

5617605