• DocumentCode
    2791499
  • Title

    Bus energy minimization by transition pattern coding (TPC) in deep sub-micron technologies

  • Author

    Sotiriadis, P.P. ; Chandrakasan, A.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
  • fYear
    2000
  • fDate
    5-9 Nov. 2000
  • Firstpage
    322
  • Lastpage
    327
  • Abstract
    The energy dissipation associated with driving long wires accounts for a significant fraction of the overall system energy. This is particularly the case with the increasing importance of the inter-wire parasitic capacitance in deep sub-micron technology. A closed form solution for estimating the energy dissipation of a data bus is presented that uses an elaborate parasitic wire model. This includes the distributed RLC effects of wires as well as the coupling between wires. We also propose a general class of coding techniques to reduce energy dissipation for data transmission by trading-off between computation and communication costs. An algorithm is presented to design efficient coding strategies to minimize energy. When the effects of interwire capacitance are taken into account, the best coding strategy is not to simply minimize transitions - an approach followed by previous research. Instead, Transition Pattern Coding (TPC) modifies the transition profile to minimize energy, and in many cases higher transition activity can result in lower energy. Results show that up to a factor of 2 reduction in energy.
  • Keywords
    integrated circuit interconnections; power consumption; system buses; RLC effects; bus energy minimization; deep sub-micron technologies; energy dissipation; parasitic capacitance; transition pattern coding; Algorithm design and analysis; Closed-form solution; Costs; Couplings; Data communication; Energy dissipation; Parasitic capacitance; Power transmission lines; Voltage; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Aided Design, 2000. ICCAD-2000. IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1092-3152
  • Print_ISBN
    0-7803-6445-7
  • Type

    conf

  • DOI
    10.1109/ICCAD.2000.896493
  • Filename
    896493