DocumentCode :
2791558
Title :
Improving SRAM Vmin and yield by using variation-aware BTI stress
Author :
Wang, Jiajing ; Nalam, Satyanand ; Qi, Zhenyu Jerry ; Mann, Randy W. ; Stan, Mircea ; Calhoun, Benton H.
Author_Institution :
Intel Corp., Hillsboro, OR, USA
fYear :
2010
fDate :
19-22 Sept. 2010
Firstpage :
1
Lastpage :
4
Abstract :
We propose a novel method that exploits BTI to partially offset variation and thus improve SRAM Vmin and yield. We show correlation between a bitcell´s power-up state and its static noise margin. By applying stress with periodic re-power-up, device mismatch can be compensated by BTI induced changes. The proposed method has no extra design and area cost. It can be applied during burn-in test to offset manufacturing variation and/or used during the lifetime of the chip to offset variation from real-time aging and hence continue to improve the margins. Simulations in 45nm show that write, read, and hold Vmin at 6σ can be reduced by 128, 75, and 91 mV, respectively. Measurements from a 16Kb 45nm SRAM demonstrate the improvement of Vmin and yield.
Keywords :
SRAM chips; integrated circuit yield; SRAM Vmin; SRAM yield; bitcell power-up state; burn-in test; device mismatch; manufacturing variation; real-time aging; static noise margin; variation-aware BTI stress; Circuit stability; Noise; Random access memory; Semiconductor device measurement; Stability analysis; Stress; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference (CICC), 2010 IEEE
Conference_Location :
San Jose, CA
ISSN :
0886-5930
Print_ISBN :
978-1-4244-5758-8
Type :
conf
DOI :
10.1109/CICC.2010.5617631
Filename :
5617631
Link To Document :
بازگشت