DocumentCode :
2791638
Title :
Micro Processing a Path to Aggressive Instrument Miniaturization for Micro and Picosats
Author :
Wesolek, Danielle M. ; Darrin, Ann Garrison ; Osiander, Robert ; Lehtonen, S. John ; Edwards, Richard L. ; Hererro, Fred A.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD
fYear :
2005
fDate :
5-12 March 2005
Firstpage :
1
Lastpage :
8
Abstract :
Advanced micro-fabrication and packaging techniques provided through microelectromechanical systems (MEMS) technology enable fabrication and system integration of a miniature flat plasma spectrometer (FlaPS) capable of making fine resolution measurements of the kinetic energy spectra and angular distributions of ions in a space environment. This instrument demonstration flies on USAFA Falconsat-3 and represents a demonstration of how advanced fabrication techniques for the microprocessing world can be utilized to derive aggressive miniaturization. High performance metrics in terms of sensitivity and resolution are achievable with significant reductions in mass and power compared to conventional spectrometers. A FlaPS instrument, including sensor-head array, printed circuit board with amplifier array electronics, power supply, and chassis has been designed and built to occupy a volume of approximately 200 cm3 in a 0.5kg, 300mW package. This technique could easily be migrated to other instruments and in the future potentially to subsystems
Keywords :
micromechanical devices; spectrometers; 300 mW; FlaPS instrument; MEMS technology; amplifier array electronics; angular distributions; flat plasma spectrometer; instrument miniaturization; kinetic energy spectra; micro processing techniques; micro-fabrication techniques; microelectromechanical systems; packaging techniques; power supply; printed circuit board; sensor-head array; Energy resolution; Fabrication; Instruments; Microelectromechanical systems; Micromechanical devices; Packaging; Plasma applications; Plasma measurements; Sensor arrays; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2005 IEEE
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-8870-4
Type :
conf
DOI :
10.1109/AERO.2005.1559555
Filename :
1559555
Link To Document :
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