Title :
A precision vertical interconnect technology
Author :
Greenstein, Michael ; Matta, Farid
Author_Institution :
Hewlett-Packard Lab., Palo Alto, CA, USA
Abstract :
An interconnection technology is described that utilizes excimer laser drilled vias and computer controlled plating to provide vertical (Z-axis) electrical connections in high-performance flexible circuits. Specifically, solid vias and hemispherical microcontacts are created with a 1-μm nearest-neighbor height precision for the microcontacts. An architecture with a novel structure is employed to simplify the ground plane connections for impedance controlled flex circuits. The rationale for material and unit-process selection is described. The laser drilling of holes for the vertical interconnects is outlined. The deposition of the metal interconnects is considered. The performance of the resulting structures is characterized. This technology was implemented with a polyimide substrate and nickel contacts
Keywords :
electrical contacts; electroplating; laser beam machining; nickel; packaging; Ni contacts; computer controlled plating; excimer laser drilled vias; ground plane connections; hemispherical microcontacts; high-performance flexible circuits; impedance controlled flex circuits; metal interconnects; nearest-neighbor height precision; polyimide substrate; solid vias; unit-process selection; vertical interconnect technology; Computer architecture; Drilling; Flexible electronics; Flexible printed circuits; Impedance; Integrated circuit interconnections; Optical control; Optical materials; Polyimides; Solids;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International
Conference_Location :
Washington, DC
DOI :
10.1109/IEMT9.1990.115008
