High density multilayer structures

Author

Lehman-Lamer, Gail ; Annas, Steven E.

Author_Institution

Textronix Inc., Beaverton, OR, USA

fYear

1990

fDate

1-3 Oct 1990

Firstpage

236

Lastpage

239

Abstract

Multilayer polyimide (MLP) structures are discussed. Recently, a low-mechanical-stress, low-dielectric-constant polyimide material has become commercially available. It can be processed using standard integrated-circuit (IC)/hybrid technologies and equipment. The material is ideally suited for use in high-density multilayer interconnect structures. The processing of thick (18-μm) polyimide layers with buried metal layers is described. Applications of single-layer and multilayer polyimide structures can be designed into existing packaging products as an enhancement or be used as an added packaging structure for high-performance devices

Keywords

modules; packaging; permittivity; polymers; high-density multilayer interconnect structures; high-performance devices; mechanical stress; multilayer polyimide structures; packaging; permittivity; polyimide material; Ceramics; Dielectric materials; Electronics packaging; Etching; Hybrid integrated circuits; Nonhomogeneous media; Polyimides; Space technology; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.115012

Filename

115012