The analysis of the structure and properties of the micabond used in the rich resin micapaper tapes

Consider the mica bond used in rich resin mica-paper tapes of class F for main insulation in a large generator of high voltage. The results reveal that introducing bismaleimide into the curved system can improve the heat deflection temperature, the flexural strength at elevated temperature, and the dielectric properties. The cured system of epoxy resin-lead benzoylate has a high heat deflection temperature, but its dielectric properties at elevated temperature and heat aging life deteriorate. The combination of these two systems is well worth notice, if the amount of added lead salt is severely controlled