DocumentCode
2793592
Title
A consideration of changes of AC breakdown voltages during an accelerated test of immersed dry-cured XLPE cables
Author
Hashizume, T. ; Shinoda, C. ; Nakamura, K. ; Hotta, M. ; Tani, T. ; Taniguchi, T.
Author_Institution
Yazaki Electric Wire Co. Ltd., Namuzu, Japan
fYear
1991
fDate
8-12 Jul 1991
Firstpage
490
Abstract
The authors describe the results of an accelerated aging test of 6.6 kV cross-linked polyethylene (XLPE) insulated cables made by a dry-curing process. The accelerated aging test described permits the study of the AC breakdown mechanism. The accelerated test was carried out by applying 6.9 kV, at 1 kHz, at room temperature, with the conductor strands and the insulation shield kept constantly moist. The AC breakdown voltage was investigated for a given aging time. Within three months of aging time, the breakdown voltage decreased to about half of the initial breakdown voltage. This decrease is found to be mainly caused by the moisture permeating the insulation of the cables. To clarify the influence of moisture on the breakdown voltage, some further tests were carried out. The results clearly show that the breakdown voltage is reduced in the presence of even an infinitesimal moisture content. Also, as expected, the presence of micro-water paths in the amorphous region caused the reduction of breakdown voltage
Keywords
ageing; cable insulation; cable testing; electric breakdown of solids; insulation testing; moisture; organic insulating materials; polymers; power cables; 1 kHz; 6.6 kV; 6.9 kV; AC breakdown voltages; XLPE cables; accelerated aging test; amorphous region; cross-linked polyethylene; dry-curing process; immersed dry-cured cable; insulated cables; micro-water paths; moisture content; moisture permeation; room temperature; Accelerated aging; Cable insulation; Cables; Conductors; Electric breakdown; Insulation testing; Life estimation; Moisture; Polyethylene; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location
Tokyo
Print_ISBN
0-87942-568-7
Type
conf
DOI
10.1109/ICPADM.1991.172104
Filename
172104
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