Ultrafast laser processing of glass for MEMS and micro-fluidic applications

An ultrafast laser processing of glass for MEMS and micro-fluidic application was presented in this paper. A low energy pulse, with an average power of 250 mW was used to write in the bulk microdevice contour along with the optical functions. The nature of the structural changes such as thermal conductivity changes was discussed in this paper from the view-point of laser processing of microdevices. New developments toward the integration of additional functionalities using ultra-fast laser exposure were also reviewed.