Title :
Technical aspects of interfacial phenomena in solid insulating systems
Author :
Kärner, H.C. ; Ieda, Mirai
Author_Institution :
Tech. Univ. of Braunschweig, Germany
Abstract :
HV insulation systems are often composed of different insulating materials. In the contact areas between these materials (interfaces) interfacing polarization may occur, resulting in an increase of both permittivity and loss tangent and, consequently, of dielectric losses. By the interaction of humidity such interfacial phenomena may be enhanced. Other important characteristics of insulating systems such as the treeing strength and the breakdown strength are also lowered by interfaces, especially when humidity has been adsorbed. Microscopic and macroscopic, internal and external interfaces are defined for composite insulation systems. Interfacial phenomena in such systems, for instance made out of fiber glass-reinforced polymeric materials, are described both under dry conditions and in the presence of water. It is demonstrated that the hydrophobic properties of materials improve the dielectric characteristics; this is true for bulk and surface properties
Keywords :
composite insulating materials; dielectric losses; dielectric properties of solids; electric breakdown of solids; high-voltage engineering; humidity; insulation; interface phenomena; permittivity; HV insulation systems; breakdown strength; bulk properties; composite insulation systems; contact areas; dielectric characteristics; dielectric losses; dry conditions; fiber glass-reinforced polymeric materials; humidity; hydrophobic properties; interfacial phenomena; interfacing polarization; loss tangent; moist conditions; permittivity; solid insulating systems; surface properties; treeing strength; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Electric breakdown; Humidity; Microscopy; Permittivity; Polarization; Solids; Trees - insulation;
Conference_Titel :
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location :
Tokyo
Print_ISBN :
0-87942-568-7
DOI :
10.1109/ICPADM.1991.172128