DocumentCode
2794231
Title
Thermal- and radiation-induced interface traps in MOS devices
Author
Sogoyan, A.V. ; Cherepko, S.V. ; Pershenkov, V.S. ; Rogov, V.I. ; Ulimov, V.N. ; Emelianov, V.V.
Author_Institution
Specialized Electron. Syst., Moscow, Russia
fYear
1997
fDate
15-19 Sep 1997
Firstpage
69
Lastpage
72
Abstract
The interface trap build-up mechanisms during post-irradiation thermal annealing and radiation-induced charge neutralisation (RICN) are experimentally investigated. The role of substrate electrons is shown to be significant in post-irradiation interface trap build-up. The RICN is found to be incapable to replace a standard thermal annealing test in terms of conservative low dose rate response estimation
Keywords
MOSFET; X-ray effects; annealing; interface states; MOSFET; interface trap build-up; low dose rate response; post-irradiation thermal annealing; radiation-induced charge neutralisation; substrate electrons; Annealing; Electron traps; Hydrogen; Instruments; Laboratories; MOS devices; Physics; Space charge; Space heating; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Radiation and Its Effects on Components and Systems, 1997. RADECS 97. Fourth European Conference on
Conference_Location
Cannes
Print_ISBN
0-7803-4071-X
Type
conf
DOI
10.1109/RADECS.1997.698848
Filename
698848
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