• DocumentCode
    2794609
  • Title

    Combined stress ageing of magnet wire enamels

  • Author

    Ratra, M.C. ; Moorching, S.N. ; Hemalatha, B. ; Sumangala, M.G. ; Poovamma, P.K.

  • Author_Institution
    Central Power Res. Inst., Bangalore, India
  • fYear
    1991
  • fDate
    8-12 Jul 1991
  • Firstpage
    707
  • Abstract
    The long-term reliability of magnet wire enamels has been ascertained conventionally using thermal endurance test procedures. Apart from the fact that this test method does not simulate the service conditions, it suffers from the disadvantage of being both subjective and time-consuming. With a view to developing quicker test methods which are objective and simulate more realistically the service conditions in the laboratory, experiments under combined thermal and electrical stresses were performed on magnet wire enamels. The authors describe the results of investigations on polyester and dual-coated polyesterimide wires under the simultaneous effect of thermal and electrical stresses. It is concluded that the combined stress test method for wire enamels not only simulates more realistic service conditions but can also detect changes in degradation mechanisms which are not so evident from the other available test methods
  • Keywords
    environmental testing; insulated wires; insulation testing; life testing; materials testing; organic insulating materials; polymers; reliability; combined stress ageing; combined stress test method; combined thermal/electrical stresses; degradation mechanisms; dual-coated polyesterimide wires; long-term reliability; magnet wire enamels; objective test methods; polyester; quicker test methods; realistic service conditions; service conditions simulation; thermal endurance test procedures; Aging; Cable insulation; Conductors; Insulation testing; Laboratories; System testing; Temperature; Thermal stresses; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-87942-568-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.1991.172163
  • Filename
    172163