DocumentCode :
2795156
Title :
Correlation between resistor characteristics and cohesive property of carbon black in resin
Author :
Nakamura, Shuhei ; Ito, Atsushi ; Kitagawa, Keiichi ; Sawa, Goro
Author_Institution :
Dept. of Electron., Mie Univ., Tsu, Japan
fYear :
1991
fDate :
8-12 Jul 1991
Firstpage :
808
Abstract :
Carbon black (CB)-reson composites have been studied through resistivity parameters (resistivity), (ρ), temperature coefficient of resistance (TCR), a parameter of the dielectric relaxation time, and equivalent circuit parameters (Rs, Rc , Cc) using two kinds of CBs. High-structure CB results in smaller ρ and TCR than does low-structure CB, suggesting that the former CB easily forms a mechanically stronger aggregation of CB structures, leading to more conductive paths bridging electrodes. There is a difference between the dielectric relaxation types on the Cole-Cole plot. The high-structure CB shows a Cole-Cole type relaxation, whereas the low-structure CB shows a Davidson-Cole one. The parameters giving a measure of the distribution of the relaxation time increase with loading. It is noted that branches of conductive paths become uniform with higher loading. Though the difference of C c between the two CBs is not clear, the high-structure CB shows smaller Rs and Rc than the low-structure one at a given loading of CB
Keywords :
composite materials; dielectric relaxation; equivalent circuits; resistors; shielding; Cole-Cole plot; Davidson-Cole relaxation; carbon black-resin composites; cohesive property; conductive paths; dielectric relaxation time; equivalent circuit parameters; resistivity; resistor characteristics; temperature coefficient of resistance; Composite materials; Conducting materials; Conductivity; Dielectrics; Organic materials; Resins; Resistors; Temperature dependence; Thermal expansion; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location :
Tokyo
Print_ISBN :
0-87942-568-7
Type :
conf
DOI :
10.1109/ICPADM.1991.172190
Filename :
172190
Link To Document :
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