DocumentCode :
2795458
Title :
TSC of oil/polymer film composite insulator with chemically etched polymer film
Author :
Ochiai, S. ; Iwasaki, H. ; Ieda, M. ; Mizutani, T.
Author_Institution :
Dept. of Electr. Eng., Aichi Inst. of Technol., Toyota, Japan
fYear :
1991
fDate :
8-12 Jul 1991
Firstpage :
875
Abstract :
The electrical properties and oil/polymer interaction for an alkylbenzene/polypropylene (PP) composite insulator with chemically etched polymer (PPc) were investigated with the thermally stimulated current (TSC), surface roughness, and FT-IR (Fourier transform infrared) methods. The etched rough surface was obtained by the dissolution of the amorphous part of the PP surface in sulfuric acid. The TSC obtained on an oil/PPc specimen has four clear peaks. The comparison in TSC between oil/PP (virgin) and oil/PPc revealed that impurities in PP exist near the surface of PP and that PPc has shallower ion traps than PP. It is concluded that the wettability of the polymer surface was improved by the chemical etching. In other words, the chemical etching of the polymer surface produces an optimum polymer surface for the impregnation of oil
Keywords :
composite insulating materials; etching; insulating oils; organic insulating materials; polymers; spectrochemical analysis; surface topography; thermally stimulated currents; wetting; FTIR method; TSC; alkylbenzene/polypropylene; chemical etching; dissolution; electrical properties; impurities; ion traps; oil impregnation; oil/polymer film composite insulator; oil/polymer interaction; polymer surface wettability; surface roughness; thermally stimulated current; Chemicals; Dielectrics and electrical insulation; Etching; Fourier transforms; Oil insulation; Petroleum; Plastic insulation; Polymer films; Rough surfaces; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
Conference_Location :
Tokyo
Print_ISBN :
0-87942-568-7
Type :
conf
DOI :
10.1109/ICPADM.1991.172208
Filename :
172208
Link To Document :
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