DocumentCode :
2795730
Title :
Quality Management in Electronics Manufacturing after Implementation of RoHS Directive
Author :
Kisiel, R. ; Bukat, K. ; Drozd, Z. ; Szwech, M. ; Syryczyk, P. ; Girulska, A.
Author_Institution :
Warsaw Univ. of Technol., Warsaw
fYear :
2007
fDate :
9-13 May 2007
Firstpage :
34
Lastpage :
39
Abstract :
The improvement of electronic interconnection systems reliability after implementation of EU Directive RoHS is currently one of the main goals in development of electronic equipment assembly. In fact, the reliability of equipment is created mainly during design and production stage. But these phases should be proceeded by research phase. During this phase the ecologically friendly materials and ecologically friendly technologies have to be selected and evaluated. Investigation of Pb-free technology for small producers of electronic equipment (SME ´s) were made in Warsaw University of Technology (WUT) in frame of GreenRoSE Project financed by EC. First part of our work was concentrated on analyze the influence of reflow oven parameters setup on soldering temperature profile and related with it electrical and mechanical properties of solder joints. On the base of performed experiments the optimal oven parameters were selected and test samples were manufactured. Finally, the reliability data of SAC and SnPb solder on PCBs with Sn and SnCu HASL finishes were investigated and compared.
Keywords :
copper alloys; integrated circuit interconnections; integrated circuit manufacture; integrated circuit reliability; lead alloys; printed circuits; quality management; reflow soldering; solders; tin alloys; EU Directive RoHS implementation; GreenRoSE Project; PCB; PCB finishing; SnCu; SnPb; Warsaw University of Technology; design stage; ecologically friendly materials; ecologically friendly technologies; electrical properties; electronic equipment assembly; electronic interconnection systems reliability; electronics manufacturing; lead-free technology; mechanical properties; production stage; quality management; reflow oven parameters setup; solder joints; soldering temperature profile; Assembly systems; Electronic equipment; Electronic equipment manufacture; Manufacturing; Ovens; Production; Quality management; Reliability; Soldering; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
Type :
conf
DOI :
10.1109/ISSE.2007.4432817
Filename :
4432817
Link To Document :
بازگشت