DocumentCode :
2795785
Title :
Yield-aware floorplanning
Author :
Wo, Zhaojun ; Koren, Israel ; Ciesielski, Maciej J.
Author_Institution :
Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA
fYear :
2005
fDate :
30 Aug.-3 Sept. 2005
Firstpage :
247
Lastpage :
251
Abstract :
Yield is normally ignored during the floorplanning stage. Recently, it has been shown that floorplanning can affect the yield with the increased sizes of chips. With the "medium-area clustering" model, yield can be evaluated during the floorplanning stage. Therefore, it\´s straightforward to incorporate yield in modern floorplanners. However, conventional simulate-annealing (SA) based moves are only designed for the combination of the area and/or the wire length minimizations. In this paper, we proposed a heuristic scheme of "moves" directly targeting on the yield improvement. The experimental results show a great yield improvement with little penalty for the area and/or the total wire length.
Keywords :
circuit layout; circuit optimisation; simulated annealing; medium-area clustering model; simulate-annealing; wire length minimization; yield-aware floorplanning; Area measurement; Delay; Joining processes; Length measurement; Packaging; Semiconductor device measurement; Semiconductor device modeling; Shape; Wire; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Digital System Design, 2005. Proceedings. 8th Euromicro Conference on
Print_ISBN :
0-7695-2433-8
Type :
conf
DOI :
10.1109/DSD.2005.80
Filename :
1559811
Link To Document :
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