Thick-film Temperature Sensors and LTCC Substrates - Evaluation and Characterization

Author

Hrovat, Marko ; Belavic, Darko ; Kita, J. ; Holc, Janez

Author_Institution

Jozef Stefan Inst., Ljubljana

fYear

2007

fDate

9-13 May 2007

Firstpage

65

Lastpage

69

Abstract

The electrical and microstructural characteristics of 1 kohm/sq. thick-film thermistors with high positive (PTC) and negative (NTC) temperature coefficients of resistivity (TCR) fired on "green" LTCC (Low-Temperature Cofired Ceramics) substrates were evaluated. Electrical characteristics, i.e., sheet resistivities, TCRs and noise indices were measured. Microstructures of thick films were investigated by scanning electron microscopy (SEM) and analysed by energy dispersive X-ray analysis (EDS). Functional phases in thermistors were determined by X-ray powder diffraction analysis. Obtained results were compared with characteristics of thick film thermistors fired on relatively inert alumina substrates which were used as a reference.

Keywords

X-ray chemical analysis; X-ray diffraction; ceramic packaging; electric noise measurement; electrical resistivity; multichip modules; scanning electron microscopy; temperature sensors; thermistors; thick film sensors; Al₂O₃; EDS; LTCC substrates; MCM; SEM; TCR; X-ray powder diffraction analysis; alumina substrates; beta factors; ceramic multichip modules; electrical characteristics; energy dispersive X-ray analysis; functional phases; high positive temperature coefficients; low-temperature cofired ceramics substrates; microstructural characteristics; negative temperature coefficients; noise indices measurement; scanning electron microscopy; sheet resistivities; thick-film temperature sensors; thick-film thermistors; Ceramics; Conductivity; Electric variables; Electric variables measurement; Noise measurement; Scanning electron microscopy; Substrates; Temperature sensors; Thermistors; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology, 30th International Spring Seminar on

Conference_Location

Cluj-Napoca

Print_ISBN

987-1-4244-1218-1

Electronic_ISBN

987-1-4244-1218-1

Type

conf

DOI

10.1109/ISSE.2007.4432822

Filename

4432822