• DocumentCode
    2795821
  • Title

    Transmission Line Pulse Stress on Thick Film Resistors

  • Author

    Bonfert, D. ; Wolf, H. ; Gieser, H. ; Svasta, P. ; Romanescu, A. ; Cazacu, E.

  • Author_Institution
    Fraunhofer Inst. Reliability & Microintegration/IZM-M, Munich
  • fYear
    2007
  • fDate
    9-13 May 2007
  • Firstpage
    70
  • Lastpage
    75
  • Abstract
    One of the most important issues of resistors properties is the value stability under different electrical and non electrical influences. Mechanical and/or thermal stress together with the electrical one represents the main factors that have a major contribution in resistor value stability. With shrinking resistor geometries of discrete, integrated and integral passives, the electrical stress gains more and more importance, especially under short duration voltage pulses. The analytical test technique of transmission line pulsers (TLP) allows, on the basis of square pulses, the in-situ monitoring of the voltages and currents at the DUT during pulsing and helps to gain fundamental insights into the electrical behavior. The influence of the pulse width and height on the current-voltage behavior was investigated on thick film chip resistors of different values and sizes. The resistance change due to an applied high voltage pulse is a measure of the electro static discharge (ESD) susceptibility of thick film resistors.
  • Keywords
    electrostatic discharge; monitoring; stability; thermal stresses; thick film resistors; transmission lines; electrical stress; electro static discharge measurement; in-situ monitoring; mechanical stress; thermal stress; thick film chip resistors; transmission line pulse stress; value stability; Geometry; Pulse measurements; Resistors; Thermal factors; Thermal resistance; Thermal stability; Thermal stresses; Thick films; Transmission lines; Voltage; ESD; Pulsed Stress; Thick Film Resistors; Transmission Line Pulsing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology, 30th International Spring Seminar on
  • Conference_Location
    Cluj-Napoca
  • Print_ISBN
    987-1-4244-1218-1
  • Electronic_ISBN
    987-1-4244-1218-1
  • Type

    conf

  • DOI
    10.1109/ISSE.2007.4432823
  • Filename
    4432823