Title :
Transmission Line Pulse Stress on Thick Film Resistors
Author :
Bonfert, D. ; Wolf, H. ; Gieser, H. ; Svasta, P. ; Romanescu, A. ; Cazacu, E.
Author_Institution :
Fraunhofer Inst. Reliability & Microintegration/IZM-M, Munich
Abstract :
One of the most important issues of resistors properties is the value stability under different electrical and non electrical influences. Mechanical and/or thermal stress together with the electrical one represents the main factors that have a major contribution in resistor value stability. With shrinking resistor geometries of discrete, integrated and integral passives, the electrical stress gains more and more importance, especially under short duration voltage pulses. The analytical test technique of transmission line pulsers (TLP) allows, on the basis of square pulses, the in-situ monitoring of the voltages and currents at the DUT during pulsing and helps to gain fundamental insights into the electrical behavior. The influence of the pulse width and height on the current-voltage behavior was investigated on thick film chip resistors of different values and sizes. The resistance change due to an applied high voltage pulse is a measure of the electro static discharge (ESD) susceptibility of thick film resistors.
Keywords :
electrostatic discharge; monitoring; stability; thermal stresses; thick film resistors; transmission lines; electrical stress; electro static discharge measurement; in-situ monitoring; mechanical stress; thermal stress; thick film chip resistors; transmission line pulse stress; value stability; Geometry; Pulse measurements; Resistors; Thermal factors; Thermal resistance; Thermal stability; Thermal stresses; Thick films; Transmission lines; Voltage; ESD; Pulsed Stress; Thick Film Resistors; Transmission Line Pulsing;
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
DOI :
10.1109/ISSE.2007.4432823