Improving manufacturing reliability in IC package assembly using FMEA technique

Author

Prasad, Shankara

Author_Institution

APT Int., Princeton Junction, NJ, USA

fYear

1990

fDate

1-3 Oct 1990

Firstpage

356

Lastpage

360

Abstract

The author describes the basic potential failure mode and effect analysis (FMEA) technique and shows how the technique is useful in improving the manufacturing reliability and final quality of an IC package, and for complex packages and multichip module assemblies. The use of FMEA for improving the manufacturability and manufacturing reliability of packages by a systematic and quantified analysis of the package design and process is also discussed. A case study is discussed to demonstrate the importance and usefulness of the FMEA technique

Keywords

assembling; circuit reliability; failure analysis; modules; packaging; quality control; FMEA technique; IC package; IC package assembly; complex packages; final quality; manufacturing reliability; multichip module assemblies; package design; potential failure mode and effect analysis; Aerospace industry; Assembly; Automobile manufacture; Failure analysis; Integrated circuit packaging; Manufacturing industries; Manufacturing processes; Multichip modules; Packaging machines; Process design;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International

Conference_Location

Washington, DC

Type

conf

DOI

10.1109/IEMT9.1990.115031

Filename

115031