Title :
Improving manufacturing reliability in IC package assembly using FMEA technique
Author :
Prasad, Shankara
Author_Institution :
APT Int., Princeton Junction, NJ, USA
Abstract :
The author describes the basic potential failure mode and effect analysis (FMEA) technique and shows how the technique is useful in improving the manufacturing reliability and final quality of an IC package, and for complex packages and multichip module assemblies. The use of FMEA for improving the manufacturability and manufacturing reliability of packages by a systematic and quantified analysis of the package design and process is also discussed. A case study is discussed to demonstrate the importance and usefulness of the FMEA technique
Keywords :
assembling; circuit reliability; failure analysis; modules; packaging; quality control; FMEA technique; IC package; IC package assembly; complex packages; final quality; manufacturing reliability; multichip module assemblies; package design; potential failure mode and effect analysis; Aerospace industry; Assembly; Automobile manufacture; Failure analysis; Integrated circuit packaging; Manufacturing industries; Manufacturing processes; Multichip modules; Packaging machines; Process design;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1990 Proceedings, Competitive Manufacturing for the Next Decade. IEMT Symposium, Ninth IEEE/CHMT International
Conference_Location :
Washington, DC
DOI :
10.1109/IEMT9.1990.115031
