Title :
Using Failure Mode Effect Analysis to Increase Electronic Systems Reliability
Author :
Goel, Anuj ; Graves, Robert J.
Author_Institution :
Rensselaer Polytech. Inst., Troy
Abstract :
This paper focuses on improving the reliability of electronic systems in the electronic packaging/manufacturing industry using failure mode and effect analysis (FMEA). The paper starts with the introduction to reliability and the FMEA, It briefly summarizes the research done in these areas, describes the benefits and limitations of the FMEA, compares various FMEA approaches, defines its scope, and offers suggestions for a multidiscipline and multifunctional team. It presents a FMEA form exclusively designed for the electronic systems industry, and provides a list of failure modes that should be considered while performing FMEA on electronic systems. While anticipating every failure mode is not possible, it formulates an extensive list of potential failure modes.
Keywords :
electronics industry; electronics packaging; failure analysis; reliability; electronic manufacturing; electronic packaging; electronic systems reliability; failure mode effect analysis; Assembly systems; Costs; Educational institutions; Electronics industry; Failure analysis; Industrial electronics; Manufacturing processes; Predictive models; Reliability engineering; Reliability theory;
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
DOI :
10.1109/ISSE.2007.4432833