DocumentCode
2795931
Title
Using Failure Mode Effect Analysis to Increase Electronic Systems Reliability
Author
Goel, Anuj ; Graves, Robert J.
Author_Institution
Rensselaer Polytech. Inst., Troy
fYear
2007
fDate
9-13 May 2007
Firstpage
128
Lastpage
133
Abstract
This paper focuses on improving the reliability of electronic systems in the electronic packaging/manufacturing industry using failure mode and effect analysis (FMEA). The paper starts with the introduction to reliability and the FMEA, It briefly summarizes the research done in these areas, describes the benefits and limitations of the FMEA, compares various FMEA approaches, defines its scope, and offers suggestions for a multidiscipline and multifunctional team. It presents a FMEA form exclusively designed for the electronic systems industry, and provides a list of failure modes that should be considered while performing FMEA on electronic systems. While anticipating every failure mode is not possible, it formulates an extensive list of potential failure modes.
Keywords
electronics industry; electronics packaging; failure analysis; reliability; electronic manufacturing; electronic packaging; electronic systems reliability; failure mode effect analysis; Assembly systems; Costs; Educational institutions; Electronics industry; Failure analysis; Industrial electronics; Manufacturing processes; Predictive models; Reliability engineering; Reliability theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 30th International Spring Seminar on
Conference_Location
Cluj-Napoca
Print_ISBN
987-1-4244-1218-1
Electronic_ISBN
987-1-4244-1218-1
Type
conf
DOI
10.1109/ISSE.2007.4432833
Filename
4432833
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