Title :
Resistance of BGA Contacts During Reliability Tests
Author :
Wrona, Rafal ; Drozd, Zdzislaw
Author_Institution :
Telecommun. Res. Inst., Warsaw
Abstract :
This paper shows the latest results of lead-free BGA solder joints investigations performed in frame of GrenRoSE Project financed by EC. First part is devoted for resistance measurement of BGA256r (pitch 1.27) contacts. Resistance was measured during mechanical bending tests. Resistance of lead-free and lead-containing BGA contacts during reliability test and reliability of these contacts were compared. Second part is devoted for reliability assessment of solder joints of BGA packages, type CSP84 (pitch 0.5 mm), BGA100 (pitch 0.8 mm), BGA144 and BGA676 (pitch 1.0 mm), BGA272 (pitch 1.27 mm), lead-free and lead-containing. These packages were tested by thermal shocks according to IPC 9701A and EN 62137 and mechanical fatigue test by bending on mechanical stand.
Keywords :
ball grid arrays; reliability; soldering; BGA256r; EN 62137; IPC 9701A; ball grid arrays; lead-containing BGA contact resistance; lead-free BGA contact resistance; lead-free BGA solder joint reliability assessment; mechanical bending test; mechanical fatigue test; reliability test; resistance measurement; thermal shock; Contact resistance; Electric shock; Electrical resistance measurement; Environmentally friendly manufacturing techniques; Lead; Mechanical variables measurement; Packaging; Performance evaluation; Soldering; Testing;
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
DOI :
10.1109/ISSE.2007.4432840
