The Evaluation of the PCB´s Behaviour under the Mechanical Stress

The aspect of the vulnerability of electronics generated by the mechanical causes requires a special analyzing and testing effort of the packages in the context of each different particular application. The main goal of this paper is to present the numerical evaluation by finite element analysis of the common class of PCBs under the mechanical stress. This work contributes to the study of packaged electronics vulnerability by comparing the numerical results with experimental tests.