DocumentCode
2796046
Title
The Evaluation of the PCB´s Behaviour under the Mechanical Stress
Author
Cazacu, Dumitru ; Ionita, Silviu ; Parlac, Sebastian
Author_Institution
Univ. of Pitesti, Pitesti
fYear
2007
fDate
9-13 May 2007
Firstpage
171
Lastpage
176
Abstract
The aspect of the vulnerability of electronics generated by the mechanical causes requires a special analyzing and testing effort of the packages in the context of each different particular application. The main goal of this paper is to present the numerical evaluation by finite element analysis of the common class of PCBs under the mechanical stress. This work contributes to the study of packaged electronics vulnerability by comparing the numerical results with experimental tests.
Keywords
electronics packaging; finite element analysis; mechanical strength; printed circuit testing; printed circuits; PCB; finite element analysis; mechanical stress; packaged electronics vulnerability; Bridge circuits; Calibration; Capacitive sensors; Electronic equipment testing; Electronic packaging thermal management; Industrial electronics; Strain measurement; Surface-mount technology; Thermal stresses; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 30th International Spring Seminar on
Conference_Location
Cluj-Napoca
Print_ISBN
987-1-4244-1218-1
Electronic_ISBN
987-1-4244-1218-1
Type
conf
DOI
10.1109/ISSE.2007.4432842
Filename
4432842
Link To Document