DocumentCode
2796398
Title
Assembly Problems in Lead-free and Mix Production
Author
Sitek, Janusz ; Drozd, Z. ; Bukat, K.
Author_Institution
Tele & Radio Res. Inst., Warsaw
fYear
2007
fDate
9-13 May 2007
Firstpage
298
Lastpage
303
Abstract
Some electronic assemblers are faced to face with the necessity to use heterogeneous assembly of both very large and very small components on the same board and mix tin-lead and lead free soldering technology. Authors try to solve the problems with pick and place very small components by special design of stencil and adjust printing and assembly parameters. The solution of the soldering problems they try to solve by optimization the soldering profiles for mix technology.
Keywords
microassembling; reflow soldering; surface mount technology; adjust printing; electronic assembly; heterogeneous assembly; mix production; reflow soldering; stencil printing; surface mount technology; Assembly; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Printing; Production; Soldering; Space technology; Surface-mount technology; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 30th International Spring Seminar on
Conference_Location
Cluj-Napoca
Print_ISBN
987-1-4244-1218-1
Electronic_ISBN
987-1-4244-1218-1
Type
conf
DOI
10.1109/ISSE.2007.4432867
Filename
4432867
Link To Document