Title :
Assembly Problems in Lead-free and Mix Production
Author :
Sitek, Janusz ; Drozd, Z. ; Bukat, K.
Author_Institution :
Tele & Radio Res. Inst., Warsaw
Abstract :
Some electronic assemblers are faced to face with the necessity to use heterogeneous assembly of both very large and very small components on the same board and mix tin-lead and lead free soldering technology. Authors try to solve the problems with pick and place very small components by special design of stencil and adjust printing and assembly parameters. The solution of the soldering problems they try to solve by optimization the soldering profiles for mix technology.
Keywords :
microassembling; reflow soldering; surface mount technology; adjust printing; electronic assembly; heterogeneous assembly; mix production; reflow soldering; stencil printing; surface mount technology; Assembly; Consumer electronics; Environmentally friendly manufacturing techniques; Lead; Printing; Production; Soldering; Space technology; Surface-mount technology; Testing;
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
DOI :
10.1109/ISSE.2007.4432867
