• DocumentCode
    2796483
  • Title

    Dielectric relaxation phenomena in model composites

  • Author

    Lavergne, Cl ; Chatain, D. ; Lacabanne, C.

  • Author_Institution
    Solid Phys. Lab., Toulouse Univ., France
  • fYear
    1991
  • fDate
    8-12 Jul 1991
  • Firstpage
    1083
  • Abstract
    Thermally stimulated current spectroscopy has been applied to the study of interfaces/interphases in composites. Three DGEBA-DDA matrix model samples have been studied. Below room temperature, two relaxation modes are observed in all samples: a γ mode at about -150°C and a β mode at -100°C. The existence of two polarization phenomena β2 and β1 shows that the β relaxation is complex. Above room temperature, the relaxation mode associated with the glass transition has been observed at 100°C. The analysis of its fine structure indicates that it is constituted of elementary processes characterized by relaxation times following a compensation law. For the upper activation enthalpies, the response of the matrix and of the two composites is analogous. For the lower activation enthalpies, the slope of the compensation line is modified. In fact, for a given enthalpy, the pre-exponential factor τO is characteristic of the matrix filler interface/interphase
  • Keywords
    composite insulating materials; dielectric polarisation; dielectric relaxation; filled polymers; glass transition (polymers); organic insulating materials; thermally stimulated currents; -150 to 100 C; DGEBA-DDA matrix model samples; TSC spectroscopy; compensation line; glass transition; model composites; polarization phenomena; relaxation times; Coatings; Composite materials; Dielectric materials; Glass; Laboratories; Physics; Polarization; Solids; Spectroscopy; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-87942-568-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.1991.172263
  • Filename
    172263