Effect of Lead-free Conductive Thick Film Materials on Ultrasonic Wire Bondability

The extent of wire bond ability of thick and thin film materials is determined by their mechanical properties. In the year 2006, there were introduced in EU new legislative regulations RoHS for materials used in electronics that have to exclude using of some chemicals, as for example Pb. This paper deals with verification of bondability and reliability of wire bonding ultrasonic process for lead-free thick film conductive materials. There were used some mechanical tests in the combination with temperature cycle aging. This testing was applied on two conductive thick film materials, one old and other lead free new.