Electrically Loaded Adhesive Bonds Formed on Different Surfaces

Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have been used. The bonds have been fabricated by assembly of jumpers. Two types of electrical load have been applied: DC current 1A and rectangular current pulses with the frequency of 500 Hz, mark-space ratio 1:1 and amplitude of 1A. The resistances, nonlinearity and noise of the bonds have been measured. It has been found that quality of the bonds on Sn surface finish is unacceptable through instability and level of measured parameters. The resistances and nonlinearity of the bonds formed on Au surface finish have been higher in comparison with those measured on Cu pads; noise have been comparable. Both types of the current load have caused low changes of all parameters tested.