Title :
Qualification and Categorization of Micro Bonds
Author :
Tsyganok, Boris ; Friedel, Jörg
Author_Institution :
Nat. Tech. Univ. of Ukraine, Kyiv
Abstract :
The method proposed allows to qualifying and categorizing micro bonds in electronic devices. The qualification process is based on two quality parameters: the value of the bonding area across the interface and the value of adhesion. A parameter matrix taking into account these two parameters was built to categorize contacts.
Keywords :
adhesive bonding; microassembling; quality assurance; adhesion parameter; bonding area parameter; electronic devices; micro bonds categorization; micro bonds qualitfication; Adhesives; Bonding; Laser beams; Optical modulation; Preamplifiers; Qualifications; Seminars; Springs; System testing; Transducers;
Conference_Titel :
Electronics Technology, 30th International Spring Seminar on
Conference_Location :
Cluj-Napoca
Print_ISBN :
987-1-4244-1218-1
Electronic_ISBN :
987-1-4244-1218-1
DOI :
10.1109/ISSE.2007.4432887
