DocumentCode
2796666
Title
Qualification and Categorization of Micro Bonds
Author
Tsyganok, Boris ; Friedel, Jörg
Author_Institution
Nat. Tech. Univ. of Ukraine, Kyiv
fYear
2007
fDate
9-13 May 2007
Firstpage
399
Lastpage
401
Abstract
The method proposed allows to qualifying and categorizing micro bonds in electronic devices. The qualification process is based on two quality parameters: the value of the bonding area across the interface and the value of adhesion. A parameter matrix taking into account these two parameters was built to categorize contacts.
Keywords
adhesive bonding; microassembling; quality assurance; adhesion parameter; bonding area parameter; electronic devices; micro bonds categorization; micro bonds qualitfication; Adhesives; Bonding; Laser beams; Optical modulation; Preamplifiers; Qualifications; Seminars; Springs; System testing; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology, 30th International Spring Seminar on
Conference_Location
Cluj-Napoca
Print_ISBN
987-1-4244-1218-1
Electronic_ISBN
987-1-4244-1218-1
Type
conf
DOI
10.1109/ISSE.2007.4432887
Filename
4432887
Link To Document