DocumentCode :
2796761
Title :
1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)
fYear :
1998
fDate :
March 31 1998-April 2 1998
Keywords :
reliability; MEMS; assembly; compound semiconductors; device processes; dielectrics; electrostatic discharge; failure analysis; hot carriers; interconnet; latchup; metallisation; optoelectronics; packaging; reliability physics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
Conference_Location :
Reno, NV, USA
Print_ISBN :
0-7803-4400-6
Type :
conf
DOI :
10.1109/RELPHY.1998.670434
Filename :
670434
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2796761
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