• DocumentCode
    2797000
  • Title

    The thermo-mechanical breakdown of ferroelectric ceramics

  • Author

    Zhigang, Zhou ; Yugong, Wu ; Yalin, Zhang ; Jinling, Luo

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
  • fYear
    1991
  • fDate
    8-12 Jul 1991
  • Firstpage
    1192
  • Abstract
    It is demonstrated that brittle fracture plays an important role in the breakdown process of ferroelectric ceramics. Mechanical fracture and dielectric failure are recognized to be microstructure sensitive, and both of these have been shown to depend upon intrinsic-extrinsic microstructure parameters and the heat diffusion condition. The toughening-strengthening effect of dispersed ZrO2 particles caused by tm martensitic transformation, which leads to crack branching and crack closing in the breakdown process, is a reasonable compromise for improving fractural strength and modified electronic properties. A thermomechanical breakdown is proposed which can replace the typical thermal breakdown mechanism of brittle electrical ceramics with lower thermal conductivity
  • Keywords
    brittle fracture; ceramics; cracks; crystal microstructure; dispersion hardening; ferroelectric materials; martensitic transformations; thermomechanical treatment; transformation toughening; breakdown process; brittle fracture; crack branching; crack closing; dielectric failure; ferroelectric ceramics; fractural strength; heat diffusion condition; intrinsic-extrinsic microstructure parameters; martensitic transformation; thermal conductivity; thermomechanical breakdown; toughening-strengthening effect; Breakdown voltage; Ceramics; Dielectric breakdown; Dielectric measurements; Electric breakdown; Ferroelectric materials; Surface morphology; Thermal conductivity; Thermomechanical processes; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 1991., Proceedings of the 3rd International Conference on
  • Conference_Location
    Tokyo
  • Print_ISBN
    0-87942-568-7
  • Type

    conf

  • DOI
    10.1109/ICPADM.1991.172291
  • Filename
    172291