DocumentCode :
2797296
Title :
LF55GN photosensitive flexopolymer as a new material for ultra-thick and high aspect-ratio MEMS fabrication
Author :
Sayah, Abdeljalil ; Parashar, Virendra K. ; Gijs, Martin A M
Author_Institution :
Ecole Polytech. Fed. de Lausanne, Lausanne
fYear :
2007
fDate :
21-25 Jan. 2007
Firstpage :
219
Lastpage :
222
Abstract :
We present the photosensitive flexopolymer LF55GN as a new material for the realisation of thick three-dimensional microstructures. The latter can be realised with a thickness up to 4 millimetres and with an aspect ratio of 10 using only a single UV exposure step. LF55GN is a unique material that allows fabricating thick components of optical quality that easily absorb stress due to the elastic nature of the material.
Keywords :
micro-optics; micromechanical devices; optical polymers; 3D microstructures; LF55GN photosensitive flexopolymer; MEMS fabrication; UV exposure; high aspect-ratio; optical quality; Fabrication; Micromechanical devices; Microstructure; Optical devices; Optical films; Optical materials; Polymers; Reservoirs; Resists; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location :
Hyogo
ISSN :
1084-6999
Print_ISBN :
978-1-4244-0950-1
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2007.4432963
Filename :
4432963
Link To Document :
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