DocumentCode :
2797652
Title :
Temperature sensor array using flexible substrate
Author :
Chia, Bonnie T. ; Chang, Duo-Ru ; Liao, Hsin-Hung ; Yang, Yao-Joe ; Shih, Wen-Pin ; Chang, Fu-Yu ; Fan, Kuang-Chao
Author_Institution :
Nat. Taiwan Univ., Taipei
fYear :
2007
fDate :
21-25 Jan. 2007
Firstpage :
589
Lastpage :
592
Abstract :
This paper presents the design, fabrication and measurement results of a flexible temperature sensor array based on MEMS technology. The temperature sensor array is composed of 256 (16times16) sensors inside a 28times20 mm2 area. Using a polyimide (PI) thin film (35 mum) with a copper layer (40 mum) on one side as the starting material, a double-sided fabrication process is applied to create the sensing elements as well as the interconnects for scanning circuitry. As the resistance of platinum changes with temperature, the corresponding temperature can be obtained by measuring the resistance of each element in the temperature sensing array.
Keywords :
microsensors; sensor arrays; temperature sensors; MEMS technology; double-sided fabrication process; flexible substrate; polyimide thin film; scanning circuitry; temperature sensor array; Copper; Fabrication; Integrated circuit interconnections; Micromechanical devices; Platinum; Polyimides; Sensor arrays; Substrates; Temperature sensors; Thin film circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location :
Hyogo
ISSN :
1084-6999
Print_ISBN :
978-1-4244-095-5
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2007.4432989
Filename :
4432989
Link To Document :
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