• DocumentCode
    2797764
  • Title

    Concave-suspended high-Q solenoid inductors with a post-CMOS MEMS process in standard wafers

  • Author

    Gu, Lei ; Li, Xinxin

  • Author_Institution
    Chinese Acad. of Sci., Shanghai
  • fYear
    2007
  • fDate
    21-25 Jan. 2007
  • Firstpage
    771
  • Lastpage
    774
  • Abstract
    We report on concave-suspended high-Q solenoid inductors with a post-CMOS MEMS process in low-resistivity silicon substrate. The 3-mask processes include copper electroplating, photo-resist spray-coating and XeF2 gaseous etching. The peak Q-factor value is measured as 47 at 5.3 GHz with 2.96 nH inductance. A compact and four curving layouts of inductors are fabricated and tested. Both finite element simulation and shock testing results show that the suspended inductor is almost free of influence from environmental vibration and shock. Featuring the high-Q value and the good robustness, the novel solenoid inductors are promising for high-performance RF IC applications.
  • Keywords
    Q-factor; finite element analysis; inductors; micromachining; silicon; solenoids; substrates; concave-suspended inductors; copper electroplating; finite element simulation; gaseous etching; high-Q solenoid inductors; photo-resist spray-coating; post-CMOS MEMS process; shock testing; three-mask processes; Copper; Electric shock; Etching; Inductors; Micromechanical devices; Q factor; Silicon; Solenoids; Spraying; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
  • Conference_Location
    Hyogo
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-095-5
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2007.4432999
  • Filename
    4432999