Title :
Early variations of the base current in In/C-doped GaInP-GaAs HBTs
Author :
Borgarino, M. ; Plana, R. ; Delage, S. ; Blanck, H. ; Fantini, F. ; Graffeuil, J.
Author_Institution :
Dipt. di Ingegneria dell´´Inf., Parma Univ., Italy
fDate :
March 31 1998-April 2 1998
Abstract :
This paper reports on the early variations of the base current (burn-in effect) in SiN passivated, double-mesa processed, In/C-doped GaInP-GaAs HBTs induced by stressing the devices at room temperature and under different bias conditions. The investigation was carried out by means of DC measurements and low frequency noise analysis, in the 250 Hz-100 kHz frequency range. The results demonstrated that the burn-in effect is due to a reduction of surface recombination currents in the extrinsic base region around the emitter perimeter. This reduction in surface recombination current is attributed to the passivation of defects at the passivation/semiconductor interface by hydrogen atoms debonded from C-H complexes in the base layer during the stress.
Keywords :
1/f noise; III-V semiconductors; carbon; electric current; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium; indium compounds; passivation; semiconductor device noise; semiconductor device testing; surface recombination; 250 Hz to 100 kHz; DC measurements; GaInP-GaAs:In,C; In/C-doped GaInP-GaAs HBTs; SiN passivated In/C-doped GaInP-GaAs HBTs; SiN-GaInP-GaAs:In,C; base current; base layer C-H complexes; bias conditions; burn-in effect; defect passivation; double-mesa processed In/C-doped GaInP-GaAs HBTs; emitter perimeter; extrinsic base region; hydrogen atom debonding; low frequency noise analysis; passivation/semiconductor interface; room temperature device stressing; surface recombination currents; Atomic layer deposition; Frequency measurement; Hydrogen; Low-frequency noise; Noise measurement; Passivation; Radiative recombination; Silicon compounds; Stress; Temperature;
Conference_Titel :
Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
Conference_Location :
Reno, NV, USA
Print_ISBN :
0-7803-4400-6
DOI :
10.1109/RELPHY.1998.670450