DocumentCode :
2798546
Title :
Composite flexural-mode resonator with controllable turnover temperature
Author :
Melamud, Renata ; Kim, Bongsang ; Hopcroft, Matthew A. ; Chandorkar, S. ; Agarwal, M. ; Jha, C.M. ; Kenny, T.W.
Author_Institution :
Stanford Univ., Stanford
fYear :
2007
fDate :
21-25 Jan. 2007
Firstpage :
199
Lastpage :
202
Abstract :
This paper presents the design and characterization of a flexural mode composite resonator whose inherent frequency sensitivity to temperature changes is reduced. The resonator is an encapsulated single anchor, double ended tuning fork (DETF) composed of single crystal silicon with a silicon dioxide coating. The frequency variation with temperature of the composite resonator exhibits a turnover temperature at which the frequency does not change with temperature. The turnover temperature can be controlled by varying the thickness of the silicon dioxide. This useful characteristic could be combined with active temperature compensation for more precise timing applications. The fabricated devices show a temperature sensitivity that is comparable to a quartz crystal tuning fork resonator.
Keywords :
coatings; compensation; composite materials; micromechanical resonators; silicon; silicon compounds; temperature control; MEMS resonators; Si-SiO2; active temperature compensation; composite flexural-mode resonator design; double ended tuning fork; frequency sensitivity; quartz crystal tuning fork resonator comparison; resonator fabrication; silicon dioxide coating thickness; single crystal silicon; temperature sensitivity; turnover temperature control; Etching; Fabrication; Resonant frequency; Silicon compounds; Softening; Temperature control; Temperature distribution; Temperature sensors; Thermal stresses; Vibrations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2007. MEMS. IEEE 20th International Conference on
Conference_Location :
Hyogo
ISSN :
1084-6999
Print_ISBN :
978-1-4244-095-5
Electronic_ISBN :
1084-6999
Type :
conf
DOI :
10.1109/MEMSYS.2007.4433054
Filename :
4433054
Link To Document :
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