DocumentCode :
2798891
Title :
Damping effects in MEMS resonators
Author :
Gologanu, M. ; Bostan, C.G. ; Avramescu, Viorel ; Buiu, Octavian
Author_Institution :
Sensors & Wireless Lab. Bucharest (SWLB), Honeywell Romania, SRL, Bucharest, Romania
Volume :
1
fYear :
2012
fDate :
15-17 Oct. 2012
Firstpage :
67
Lastpage :
76
Abstract :
Damping effects are very important in MEMS-based sensors and actuators. In this paper we use analytical models and finite element (FE) computations to quantify the energy losses due to viscous fluid damping, acoustic radiation and thermo-elastic damping. To treat the case where squeeze/slide film models can not be applied, we have implemented in a commercial FE package a new incompressible flow solver based on a gauge formulation. We are thus able to solve for full flows around complex 3D geometries in the frequency domain and predict viscous damping of resonant MEMS structures. The full methodology is exemplified on the response of a MEMS silicon resonator, including acoustic driving and piezoelectric sensing.
Keywords :
damping; finite element analysis; frequency-domain analysis; microactuators; microfluidics; micromechanical resonators; microsensors; silicon; thermoelasticity; viscosity; FE computations; MEMS resonators; MEMS silicon resonator; MEMS-based actuators; MEMS-based sensors; acoustic driving; acoustic radiation; analytical models; commercial FE package; complex 3D geometry; damping effects; energy losses; finite element computations; frequency domain; gauge formulation; incompressible flow solver; piezoelectric sensing; resonant MEMS structures; squeeze/slide film models; thermo-elastic damping; viscous fluid damping; Acoustic beams; Acoustics; Damping; Equations; Mathematical model; Micromechanical devices; Vibrations; Damping; MEMS; Modelling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference (CAS), 2012 International
Conference_Location :
Sinaia
ISSN :
1545-857X
Print_ISBN :
978-1-4673-0737-6
Type :
conf
DOI :
10.1109/SMICND.2012.6400695
Filename :
6400695
Link To Document :
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