• DocumentCode
    2798914
  • Title

    A review of WBG power semiconductor devices

  • Author

    Millan, James

  • Author_Institution
    Centro Nac. de Microelectron., Inst. de Microelectron. de Barcelona, Univ. Autonoma de Barcelona, Barcelona, Spain
  • Volume
    1
  • fYear
    2012
  • fDate
    15-17 Oct. 2012
  • Firstpage
    57
  • Lastpage
    66
  • Abstract
    It is worldwide accepted that a real breakthrough in the Power Electronics field mainly comes from the development and use of Wide Band Gap (WBG) semiconductor devices. WBG semiconductors such as SiC, GaN, and diamond show superior material properties, which allow operation at high switching speed, high voltage and high temperature. These unique performances provide a qualitative change in their applications for energy processing. From energy generation to the end-user, the electric energy undergoes a number of conversions, which are currently highly inefficient to the point that it is estimated that only 20% of the whole energy involved in energy generation reaches the end-user. WGB semiconductors increase the conversion efficiency thanks to their outstanding material properties. The recent progress in the development of high voltage WBG power semiconductor devices, especially SiC and GaN, is reviewed. Future trends in device development and industrialization are also addressed.
  • Keywords
    III-V semiconductors; gallium compounds; materials properties; power electronics; power semiconductor devices; silicon compounds; wide band gap semiconductors; GaN; SiC; WBG power semiconductor devices; conversion efficiency; end-user; energy generation; material properties; power electronics field; wide band gap semiconductor devices; Gallium nitride; MOSFETs; Rectifiers; Schottky diodes; Silicon; Silicon carbide; Substrates; GaN; HEMTs; MOSFETs; SiC; power devices; rectifiers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference (CAS), 2012 International
  • Conference_Location
    Sinaia
  • ISSN
    1545-857X
  • Print_ISBN
    978-1-4673-0737-6
  • Type

    conf

  • DOI
    10.1109/SMICND.2012.6400696
  • Filename
    6400696